Plasma Technology

Optical Emission Spectroscopy (OE)
for system "fingerprinting"

 

 

normal use of optical emission for endpoint detection,
when the etch comes to a layer underneath
The graph is taken during the ‘overetch’ period.
The intensities of up to 3 wavelengths can be datalogged.
The ratio of emission intensities can be used for endpointing,
(e.g. in cases which require increased sensitivity)

 

System "fingerprinting"

The graph shows the effect of a contaminated chamber (polymer) on the emission spectrum.


effect of an air leak

 

MFC error

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effect of poor RF matching

 


 

 

 

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