Plasma Technology  


OPT applications lab:
rate and refr index vs deposition temperature

depth profile analysis using XPS for the
film deposited at 400°C with a refr index of 1.65
45% Al, 55% O
N and C content < 0.5%
The oxygen content is slightly lower
than stoichiometric Al2O3 by ~5%,
coinciding with a 5% higher aluminum content.



Plasmalab System 133
Parallel Plate PECVD
with Flexible Vapour Delivery (FVD) System

 

-> DOWNLOAD PAPER (0.2 MB)

Al2O3 PECVD


PECVD technology


Equipment:
Plasmalab System 100/ 133

Technology:
Parallel Plate Reactor
Shower Head Gas inlet
TMA based process

Results:
Rate : > 20 nm/min
Uniformity: ± 5 % over 200 mm
Reproducibility: +/- 2 %
Refractive Index: ca 1.64

link to homepage email to OPT