Plasma Technology  


System 100
with cassette handling and 2 ICP modules


SEM

Via hole etched in BCB
with kind permission of:
FhG IAF Freiburg, Dr Bronner

BCB ICP Etching


Equipment:
Plasmalab System 100/ 133

Technology:
Reactive Ion Etching
Inductive Coupled Plasma Source
He backside cooling

Results:
etch rate ca 200 nm/ min
uniformity < ±2.5 % (6”)


ICP RIE schematic

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