Plasma Technology  


20 µm Bi2Te3 etched by ICP - RIE


one leg

Plasmalab System 100
with ICP380

Bi2Te3 ICP Etching

rate > 20 µm/ hr
uniformity +/- 4 % over 100 mm
selectivity to PR > 1 : 1

MicroPelt Peltier coolers and MicroPelt thermogenerators
The manufacturing is performed using micro electronic techniques. Substrates are standard silicon/silicondioxide wafers. The thermoelectric Bi2Te3 related films are dry etched using the Plasmalab System 100 with ICP380.

with kind permission of
Infineon Technologies AG
Fraunhofer - IPM Freiburg



ICP Technology

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