Plasma Technology  


magnetron sputtering


Cu Magnetron Sputter Deposition


Plasmalab System 400
with vacuum loadlock

 


The SEMs show 3 µm Cu deposited on
a 5: 1 aspect ratio line.
There is a continuous metal film on the walls.

Up to 8 µm thick Cu films have been deposited.
It is normally necessary to do an in situ
preclean and to deposit an adhesion layer first.
The system can do that in an automatic sequence.

 

Equipment:
Plasmalab System 400 (max 4 200 mm targets)

Technology:
Magnetron Sputtering
rotating table

Results:
24 nm/ min in rotating (batch) mode (at 1 kW)
Resistivity ~ 2.0 µohm.cm
low stress
uniform and repeatable process
excellent step coverage



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