Plasma Technology  

SEM

5 µm deep, anisotropic diamond
etch at 50 nm/ min


RIE with ICP source

 

OPT application lab:
5 µm deep, anisotropic diamond
etch at 320 nm/ min
selectivity to Cr mask > 35 : 1

Diamond Etching: RIE and ICP-RIE


Plasmalab System 100
with ICP380 source


Reactive Ion Etching (RIE)

 

OPT application lab:
40 µm deep, anisotropic diamond
etch at 50 nm/ min
selectivity to Si/ SiN mask > 1:1/ 2:1


PlasmaPro NGP 80

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