Plasma Technology  

SEM

Courtesy of Infineon Munich:
etched to M3


Reactive Ion Etching


Plasmalab 80 Plus
with laser interferometer

Failure Analysis / Reverse Engineering

Equipment:
Plasmalab 80 Plus
  for chips and up to 200 mm wafer
Plasmalab 800 Plus
  for chips and up to 300 mm wafer
Plasmalab System 100/ 133


Results:
rate : ca 40 nm/min (chip)
residue free etch

Good uniformities over 
200/ 300 mm wafers can be achieved.


SEM

Courtesy of Infineon Munich:
etched to M1


SEM

Courtesy of Infineon Munich:
etched to M2

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