Plasma Technology  

OPT application lab:
Polyimide removed from a 300 mm wafer

Technology:
Parallel Plate Reactor
13.56 MHz - Plasma Excitation
RIE / PE changeover


Laser Interferometry can be used for
determining the end point.


RIE with
laser interferometer

Polyimide Etching (RIE) for Failure Analysis


Plasmalab 80 Plus (RIE)
with laser interferometer


OPT application lab:
Polyimide removed from a 200 mm wafer

Results:
Rate > 100 nm/ min
Selectivity to SiN > 15 : 1
Uniformity +/- 6 % (300 mm wafer)


Plasmalab 800 Plus
300mm Si wafer being processes

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