Plasma Technology  

OPT application lab:
15 µm deep microfluidic channel
etched in glass

Plasmalab System 100
with loadlock
and ICP380 source

ICP technology

Glass (Borofloat) Dry Etching

OPT application lab:
10 µm deep, anisotropic glass etch

Depth: 3.7µm
Etch rate: 186 nm/min
Selectivity: 30:1 over Cr mask
Profile: 78° average
Sidewalls: somewhat rough, slightly trenched
Base: smooth

Borofloat Glass
SiO2 81%
B2O3 9%
Na2O/K2O 4%
Al2O3 2%

Na and K in particular make the glass difficult
to etch because these elements have to be
sputter etched which acts as a rate limiting step.

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