Plasma Technology  

Chalmers uses the two ion beam
systems of the 300 and 300 Plus
series for CAIBE processing.
The newer Ionfab 300 is equipped with
a vacuum loadlock, a RF source and
a filamentless PBN Neutraliser.

The photo shows the Ionfab 300 Plus ,
which has replaced the Ionfab 300.

with kind permission of:
Chalmers University of Technology
Dr M Hagberg / Dr N Eriksson
Dr A Larsson/ M Ghisoni/ J Bengtsson

Ionfab 300 Plus

CAIBE/ RIBE technology


Heterostructure etched with BCl3/ Cl2


Mesa etching of vertical-cavity
surface-emitting lasers (VCSEL)

The samples were etched by RIBE
using the normal Cl2 and BCl3 chemistry.
1 µm thick Copolymer was used as the
patterning resist. The selectivity to the
VCSEL of 6:1 allows such deep structures
to be etched into GaAs/AlGaAs.

GaAs/ AlGas RIBE viewed under different angles
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