Plasma Technology  


OPT application lab, Yatton:
100 µm deep via hole
etched in InP

RIE technology

Plasmalab 80 Plus

InP Via Hole RIE Etching

RIE-Mode: 13.56 MHz
Shower Head Gas Inlet
BCl3 and HBr based process

rate > 2.5 µm/ min
uniformity < +/- 5 % (3” wafer)
selectivity > 15:1 to PR
profile: anisotropic (or shaped)

Plasmalab System 133

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