Plasma Technology  

photonic crystals etched in Si

OPT application lab: 
5 µm holes etched in Si with stop on SiO2


ICP Technology

Photonic Crystals Etching in Si


Plasmalab System 100
with ICP380


0.75 µm diameter holes etched to the bottom

etch stop on SiO2

etch rate 50 - 100 nm/ min

uniformity over 6": +/- 4 %

anisotropic profile

HBr based process

etch depth up to 10 µm at 5 : 1 aspect ratio

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