Plasma Technology  

SEM

OPT application lab:
8 m deep, anisotropic Polyimide Etch
using a silylated PR mask



ICP technology



Plasmalab System 100
with ICP 180 source

Deep anisotropic Polyimide ICP Etching


SEM

OPT application lab:
high rate 50 µm deep etch

laser signal and derivative

laser interferometer for
in situ depth measurement


Technology:

Reactive Ion Etching (RIE)
Inductive Coupled Plasma (ICP) Source
13 MHz driven substrate holder
He cooling



Results:

Rate : > 1.5 µm/ min
3 µm/ min with some undercut
Mask: Ti, Al, Cr, W or SiOxNy
Uniformity: +/- 3% (100 mm wafer)
Profile: anisotropic (89 - 90°)
Selectivity to Si based PR > 30 : 1
to Ti > 30 : 1


SEM

OPT application lab:
2 - 10 µm deep, anisotropic Polyimide Etches

SEM

SEM

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