Plasma Technology  

0.3 µm line  top view

0.3 µm wide lines
etched in photoresist


RIE technology


Plasmalab 80 Plus

Anisotropic Photoresist RIE: 0.3 µm lines


Mr Widmer uses his Plasmalab 80 Plus RIE
system for Fluorine and O2 RIE processes.
The etcher is equipped with a Laser
Interferometer for end point detection.

 

with kind permission of:
  Paul Scherrer Institute Zuerich
  Mr Widmer



0.3 µm line  side view

0.3 µm wide lines
etched in photoresist


The SEM's show 0.3 µm wide lines
(Cr not removed)

rate: 50 nm/ min with O2 RIE

laser interferometry for end
point detection

Uniformity  < ± 3  %

link to homepage email to OPT