Plasma Technology  

OPT application lab:
0.3 µm wide, 1 µm deep etch


Reactive Ion Etching


Plasmalab 800 Plus

Quartz RIE


OPT application lab:
0.3 µm wide, 1 µm deep etch


Equipment:

Plasmalab 80 Plus
Plasmalab 800 Plus
Plasmalab System 133
Plasmalab System 100

Results: (Fluorine process)
rate : ca 50 nm/ min
uniformity: +  4%
selectivity to Cr mask > 30 : 1
selectivity to Ni mask > 80 : 1
anisotropic process
excellent linewidth control


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OPT application lab:
0.15 µm wide, 600 nm deep quartz etch

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