Plasma Technology  


ICP technology

 

This results have been obtained at
Lawrence Berkeley National laboratory
by D. L. Olynik and I. W. Rangelow



dual chamber Plasmalab System 100
with transfer loadlock and ICP380 source

Nanoscale Si Etching by Gas Chopping




-> show gas chopping principle

Technology:
Reactive Ion Etching
Inductive Coupled Plasma Source
room temperature process
He backside cooling
process with gas chopping:
isotropic etch/ polymer formation


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