Plasma Technology  


Raman spectra highlighting the a-Si signature

 


The refractive index stays constant
over a wide range of deposition rates.

Si pulsed DC magnetron sputtering


magnetron sputtering


Equipment:
Plasmalab System 400
(max 4 200 mm targets)

Technology:
Magnetron Sputtering
rotating table
pusled DC magnetron

Results:
High rate a-Si deposition
   up to 160 nm/min in static mode (H2 free)
Excellent film adhesion
Film stress 200-300 MPa compressive
Refractive index 4.5 ± 0.1


Plasmalab System 400
with vacuum loadlock

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