|Oxford Plasma Technology|
|Hr Castricher uses his Plasmalab 800 Plus DP system for depositing SiN
films with low tensile stress and low KOH etch rate. It forms a free standing membrane
after a wet etch step in KOH (for etching the bulk Si).
The Plasmalab 800 Plus can deposit batches of up to twelve 100 mm wafers per run.
with kind permission of:
|Low Stress SiN films for free standing membranes|
|Stress controlled SiN PECVD||Si3N4 Conformal PECVD||PECVD of Dielectrics|