Plasma Technology  



OPT application lab:
fused Si ICP etch
PR mask by grey scale lithography
rate 100 nm/ min
selectivity adjustable 1 - 1.5
(resist dependent)


ICP technology


Plasmalab System 100
with loadlock and ICP380 source

Grey Scale Lithography: fused Silica etching


fused silica ICP etch

OPT application lab:
fused Si ICP etch
PR mask by grey scale lithography
rate 100 nm/ min
selectivity adjustable 1 - 1.5
(resist dependent)

fused silica ICP etch



A grey-scale resist mask was used here, i.e. the sawtooth
profile was defined in the resist mask, and then tranferred
into the SiO2 using an SiO2 etch process with a low
selectivity to resist.



 

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