Plasma Technology  

SEM

OPT application lab, Yatton:
4 µm deep, anisotropic
SiO2/ TiO2 multilayer RIE


RIE technology


Plasmalab 80 Plus
with laser interferometer

SiO2/ TiO2 Multilayer RIE


Reactive Ion Etching (RIE)
13.56 MHz Plasma Excitation

Rate : 40 nm/min
(65 nm/ min for SiO2/Ta2O5)
Uniformity: +/- 4 %
Selectivity to PR mask: 0.8 :1
(1.1 : 1 for SiO2/ Ta2O5)


SEM
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