Plasma Technology  

SEM

magnetron sputtering


SEM

Al Sputter Deposition with excellent step coverage


SEM

The SEMs show Al deposited on
1 : 1 and 2 : 1 aspect ratio Si lines.
There is a continuous metal film
on the walls, even into the notch
at the bottom corners !

Equipment:
Plasmalab System 400 (max 4 200 mm targets)

Technology:
Magnetron Sputtering
rotating table

Results:
rate: 50 nm/ min at 5 kW
uniformity: +/- 5 % (6” wafer)
excellent step coverage
smooth surface


Plasmalab System 400
with vacuum loadlock

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