Plasma Technology  

SEM

Al deposited over an SiO2 step
Courtesy of TU Twente, MESA


magnetron sputtering


Plasmalab System 400
with vacuum loadlock

Sputter Deposition

 

 

Deposition Rates

Rates are given in nm/min for static sputtering
at 1 kW dc target power.
Rotation without a uniformity shield:
divide the rate by 5.
Rotation with a uniformity shield:
divide these rates by 12.

Sputter Depostion Uniformities

Al 120
Ag 340
Au 280
Cr 130
Co 90
Cu 230
Hf 83
Ir 120
Mo 90
Ni 20*
Nb 65
Os 95
Pd 240
Pt 160
Re 90
Rh 150
Si 130
Ta 60
Th 70
Tl 60
Ti 58
V 70
W 60
Zr 75

* Ni at 500 Watt

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