Plasma Technology  

SU-8 RIE etch

courtesy of Imperial College London,
Dr A S Holmes
20 µm deep, anisotropic SU-8 RIE
mask: Ni, rate: 1.5 µm/ min


Plasmalab 80 Plus


RIE technology

SU- 8 Dry Etching


SU-8 ICP etch SU-8 ICP etch

isotropic SU-8 removal: ICP RIE
lateral rate > 1 µm/ min


Plasmalab System 100


ICP RIE technology

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