Plasma Technology  


Plasmalab System 100
with vacuum loadlock


500 nm deep etch into TiO2 at 30° tilt
with kind permission of
Uni Eastern Finland, Joensuu


Plasmalab 80 Plus

Tilted TiO2 Etching by RIE


RIE technology


Technology:
Reactive Ion Etching
13 MHz Plasma Excitation
Parallel Plate Reactor

Results:
Rate : > 25 nm/min
Profile: tilted
(substrates on a tilted plane)
Surface: low roughness
Uniformity: only over small areas
Mask: Cr

link to homepage email to OPT