Plasma Technology  

Plasmalab System 100
with vacuum loadlock

500 nm deep etch into TiO2 at 30° tilt
with kind permission of
Uni Eastern Finland, Joensuu

Plasmalab 80 Plus

Tilted TiO2 Etching by RIE

RIE technology

Reactive Ion Etching
13 MHz Plasma Excitation
Parallel Plate Reactor

Rate : > 25 nm/min
Profile: tilted
(substrates on a tilted plane)
Surface: low roughness
Uniformity: only over small areas
Mask: Cr

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