Plasma Technology  


OPT applications lab:
EDS analysis
(Si peak due to substrate)

 

OPT Application lab:
conformal ICP PECVD of TiO2



Plasmalab System 133
Parallel Plate PECVD
with Flexible Vapour Delivery (FVD) System

 

ICP PECVD system
with Flexible Vapour Delivery (FVD) System

 

TiO2 PECVD


ICP PECVD technology


Equipment:
Plasmalab System 100/ 133

 

Results:
Rate : 2 - 5 nm/min
Uniformity: ± 5 %
Reproducibility: +/- 3 %
Refractive Index: 1.8 - 2.1
stress: controllable between compressive and tensile
step coverage: > 50 %

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