Plasma Technology  

Plasmalab System 100
with vacuum loadlock
and ICP 180 source


SEM

1 µm deep etch at 83°
OPT application lab, Yatton (UK)


Plasmalab 80 Plus
with ICP 65 source

ZnO ICP Etching


ICP technology


Technology:
ICP - RIE
13 MHz Plasma Excitation
Parallel Plate Reactor

Results:
Rate : > 100 nm/ min
Uniformity: +/- 4 %
The mask can be SiO2, SiN, Ni or photoresist.

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