Plasma Technology  

Plasmalab System 100
with vacuum loadlock

0.85 µm deep, anisotropic etch
Photoresist mask intact
OPT application lab, Yatton (UK)

Plasmalab 80 Plus

ZnS RIE Etching

RIE technology

Reactive Ion Etching
13 MHz Plasma Excitation
Parallel Plate Reactor

Rate : ca. 20 nm / min
Profil: anisotropic
Surface: low roughness
Uniformity: +/- 5 % (75 mm)
Mask: Photoresist

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